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From Silicon to the Sea: Managing Heat Aboard Modern Ships
Troy, N.Y. — With a major grant from the Office of Naval
Research, researchers at Rensselaer Polytechnic Institute are
collaborating with four other universities to address a hot
topic in today’s military: how to keep modern ships cool in
extreme environments.
Led by the University of Virginia and funded under the
Department of Defense Multidisciplinary University Research
Initiative (MURI) program, the overall research aim will be to
develop cooling techniques that can be used for thermal
management of large-scale, distributed high-power electronic
systems. The project is funded by a $7.5 million grant, and
Rensselaer stands to receive $3.4 million over the next five
years for its portion of the research.
In today’s modern warfront, sailors and other military
personnel are asked to operate more advanced electronics in
hotter climates. Modern military ships, offices, and planes
have thousands of computers, lights, and other electronics
whirring and working at once, generating extremely high
temperatures that require advanced cooling systems.
Because of the increasing power levels of today’s
electronics, and the need for these systems to operate at
super-fast speeds in extreme environments, researchers need to
find new cooling methods to lengthen the life of electronics
and increase system performance, according to Michael Jensen,
professor of mechanical, aerospace, and nuclear engineering and
project manager for Rensselaer’s part of the project.
The researchers involved in the cross-university
collaboration will work to develop thermal management
techniques that reduce device temperatures below 50 degrees
Celsius. To do this, each of the universities will use their
research strengths, handling different research thrusts that
will later be integrated to help develop the next generation of
ultra-efficient electronic systems.
“We are looking to make fundamental advancements in thermal
regulation of electronic systems, from pinky-nail-sized chips
to an entire computer server farm at a high-tech company or a
500-foot Navy ship,” Jensen said.
Rensselaer will lead the research thrust examining the
potential of using liquids to cool electronic systems. They
will focus on interactions at the interface between hot
electronic circuitry and a liquid, as well as determining how
to integrate and manage the cooling of thousands of
heat-generating sources distributed over a wide area.
“We are reaching the limit of what we can do with air
cooling of new computer chips,” Jensen said. “We are now
looking at liquid cooling as an alternative method to cool
electronic circuitry.”
Rensselaer researchers will work to uncover the mechanisms
that govern fluid flow and heat transfer in novel electronic
cooling systems. As part of that process they will examine the
flow and cooling levels of different liquids through
micro-devices. This will help them develop modifications to
material surface chemistry and structure, understand ideal
microchannel configurations and examine the use of nanoparticle
suspensions within liquid coolants to improve overall
cooling.
Rensselaer also will play a major role in a thrust to design
a large-scale thermal system simulator. The simulator will
create models of different distributed heat sources and cooling
systems and permit researchers to model and control the cooling
of a system over time, allowing the military to test cooling
techniques prior to implementation.
Rensselaer is joined in the research effort by the
University of Virginia (lead institution), Arizona State
University, the University of California – Berkley, and the
University of Illinois – Urbana-Champaign. The Rensselaer team
also includes Professors Yoav Peles and John Wen, as well as
the support of the Department of Mechanical, Aerospace, and
Nuclear Engineering; the Department of Electrical, Computer,
and Systems Engineering; and the Center for Automation
Technologies and Systems.
The grant funding is part of a total $207 million in
research funding announced March 7 by the Department of Defense
(DoD). The MURI program supports multidisciplinary research in
areas of DoD relevance that intersect more than one traditional
science and engineering discipline. It allows teams of
researchers with a variety of expertise to work together to
accelerate research progress.
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Published
April 16,
2007 |
Contact: Gabrielle DeMarco
Phone: (518) 276-6542
E-mail: demarg@rpi.edu |
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