Troy, N.Y. — Rensselaer Polytechnic Institute has received $500,000 from New York state to partner with Polyset Company Inc. in the commercialization of patented polymer materials for use in nanotechnology imprinting. The materials would be used for new electronic packaging increasingly needed by the semiconductor industry for “very small” technologies.

The award, made through the New York State Office of Science, Technology, and Academic Research (NYSTAR) Technology Transfer Incentive Program, is designed to promote, encourage, and facilitate economic development in New York through university-based or corporate-sponsored research that assists companies in commercializing high-technology products and bring them to the marketplace.

“New York state continues to assist universities and businesses by recognizing the importance of technology transfer from academia to the business world,” said Omkaram “Om” Nalamasu, vice president for research at Rensselaer. “At Rensselaer, our industry partners, business incubator, and Technology Park help move research from the lab to the marketplace to spur economic growth. New York state’s support is vital to our efforts.”  

Rensselaer is working with Polyset Company Inc. of Mechanicville, N.Y., to optimize, validate, and commercialize the patented polymers, which were developed and patented jointly by Rensselaer and Polyset and licensed exclusively to Polyset.

“Successful optimization of these materials for packaging would be useful for current photolithography technology and for the expected semiconductor industry transition to imprint technology at the micro- and nanometer scale,” said Toh-Ming Lu, the R.P. Baker Distinguished Professor of Physics at Rensselaer and principal investigator for the project.

Contact: Theresa Bourgeois
Phone: (518) 276-2840
E-mail: bourgt@rpi.edu